Mechanical Characterization of Materials and Wave Dispersion. Instrumentation and Experiment Interpretation

Dynamic tests have proven to be as efficient as static tests and are often easier to use at lower frequency. Over the last 50 years, the methods of investigating dynamic properties have resulted in significant advances. This book explores dynamic testing, the methods used, and the experiments performed, placing a particular emphasis on the context of bounded medium elastodynamics. The discussion is divided into four parts. Part A focuses on the complements of continuum mechanics. Part B concerns the various types of rod vibrations: extensional, bending, and torsional. Part C is devoted to mechanical and electronic instrumentation, and guidelines for which experimental set-up should be used are given. Part D concentrates on experiments and experimental interpretations of elastic or viscolelastic moduli. In addition, several chapters contain practical examples alongside theoretical discussion to facilitate the reader?s understanding. The results presented are the culmination of over 30 years of research by the authors and as such will be of great interest to anyone involved in this field.

The Handbook of Composites From Renewable Materials comprises a set of 8 individual volumes that brings an interdisciplinary perspective to accomplish a more detailed understanding of the interplay between the synthesis, structure, characterization, processing, applications and performance of these advanced materials. The handbook covers a multitude of natural polymers/ reinforcement/ fillers and biodegradable materials. Together, the 8 volumes total at least 5000 pages and offers a unique publication. This 3rd volume of the Handbook is solely focused on the Physico-Chemical and Mechanical Characterization of renewable materials. Some of the important topics include but not limited to: structural and biodegradation characterization of supramolecular PCL/HAP nano-composites; different characterization of solid bio-fillers based agricultural waste material; poly (ethylene-terephthalate) reinforced with hemp fibers; poly (lactic acid) thermoplastic composites from renewable materials; chitosan –based composite materials: fabrication and characterization; the use of flax fiber reinforced polymer (FFRP) composites in the externally reinforced structures for seismic retrofitting monitored by transient thermography and optical techniques; recycling and reuse of fiber reinforced polymer wastes in concrete composite materials; analysis of damage in hybrid composites subjected to ballistic impacts; biofiber reinforced acrylated epoxidized soybean oil (AESO) biocomposites; biopolyamides and high performance natural fiber-reinforced biocomposites; impact of recycling on the mechanical and thermo-mechanical properties of wood fiber based HDPE and PLA composites; lignocellulosic fibers composites: an overview; biodiesel derived raw glycerol to value added products; thermo-mechanical characterization of sustainable structural composites; novel pH sensitive composite hydrogel based on functionalized starch/clay for the controlled release of amoxicillin; preparation and characterization of biobased thermoset polymers from renewable resources; influence of natural fillers size and shape into mechanical and barrier properties of biocomposites; composite of biodegradable polymer blends of PCL/PLLA and coconut fiber – the effects of ionizing radiation; packaging composite materials from renewable resources; physicochemical properties of ash based geopolymer concrete; a biopolymer derived from castor oil polyurethane; natural polymer based biomaterials; physical and mechanical properties of polymer membranes from renewable resources

Think like an electron Organic electronic materials have many applications and potential in low-cost electronics such as electronic barcodes and in light emitting devices, due to their easily tailored properties. While the chemical aspects and characterization have been widely studied, characterization of the electrical properties has been neglected, and classic textbook modeling has been applied. This is most striking in the analysis of thin-film transistors (TFTs) using thick “bulk” transistor (MOS-FET) descriptions. At first glance the TFTs appear to behave as regular MOS-FETs. However, upon closer examination it is clear that TFTs are unique and merit their own model. Understanding and interpreting measurements of organic devices, which are often seen as black-box measurements, is critical to developing better devices and this, therefore, has to be done with care. Electrical Characterization of Organic Electronic Materials and Devices Gives new insights into the electronic properties and measurement techniques for low-mobility electronic devices Characterizes the thin-film transistor using its own model Links the phenomena seen in different device structures and different measurement techniques Presents clearly both how to perform electrical measurements of organic and low-mobility materials and how to extract important information from these measurements Provides a much-needed theoretical foundation for organic electronics

Sustainable development is a very prevalent concept of modern society. This concept has appeared as a critical force in combining a special focus on development and growth by maintaining a balance of using human resources and the ecosystem in which we are living. The development of new and advanced materials is one of the powerful examples in establishing this concept. Green and sustainable advanced materials are the newly synthesized material or existing modified material having superior and special properties. These fulfil today’s growing demand for equipment, machines and devices with better quality for an extensive range of applications in various sectors such as paper, biomedical, textile, and much more. Volume 1 gives overviews on a variety of topics of characterization of green and sustainable advanced materials including biopolymers, biocomposites, nanomaterials, polymeric materials, green functional textiles materials and hybrid materials, as well as processing chapters on the design and process aspects of nanofabrication.

Microstructural characterization is usually achieved by allowing some form of probe to interact with a carefully prepared specimen. The most commonly used probes are visible light, X-ray radiation, a high-energy electron beam, or a sharp, flexible needle. These four types of probe form the basis for optical microscopy, X-ray diffraction, electron microscopy, and scanning probe microscopy. Microstructural Characterization of Materials, 2nd Edition is an introduction to the expertise involved in assessing the microstructure of engineering materials and to the experimental methods used for this purpose. Similar to the first edition, this 2nd edition explores the methodology of materials characterization under the three headings of crystal structure, microstructural morphology, and microanalysis. The principal methods of characterization, including diffraction analysis, optical microscopy, electron microscopy, and chemical microanalytical techniques are treated both qualitatively and quantitatively. An additional chapter has been added to the new edition to cover surface probe microscopy, and there are new sections on digital image recording and analysis, orientation imaging microscopy, focused ion-beam instruments, atom-probe microscopy, and 3-D image reconstruction. As well as being fully updated, this second edition also includes revised and expanded examples and exercises, with a solutions manual available at http://develop.wiley.co.uk/microstructural2e/ Microstructural Characterization of Materials, 2nd Edition will appeal to senior undergraduate and graduate students of material science, materials engineering, and materials chemistry, as well as to qualified engineers and more advanced researchers, who will find the book a useful and comprehensive general reference source.

This book provides a comprehensive review of the state-of-the-art in the development of new and innovative materials, and of advanced modeling and characterization methods for nanoscale CMOS devices. Leading global industry bodies including the International Technology Roadmap for Semiconductors (ITRS) have created a forecast of performance improvements that will be delivered in the foreseeable future – in the form of a roadmap that will lead to a substantial enlargement in the number of materials, technologies and device architectures used in CMOS devices. This book addresses the field of materials development, which has been the subject of a major research drive aimed at finding new ways to enhance the performance of semiconductor technologies. It covers three areas that will each have a dramatic impact on the development of future CMOS devices: global and local strained and alternative materials for high speed channels on bulk substrate and insulator; very low access resistance; and various high dielectric constant gate stacks for power scaling. The book also provides information on the most appropriate modeling and simulation methods for electrical properties of advanced MOSFETs, including ballistic transport, gate leakage, atomistic simulation, and compact models for single and multi-gate devices, nanowire and carbon-based FETs. Finally, the book presents an in-depth investigation of the main nanocharacterization techniques that can be used for an accurate determination of transport parameters, interface defects, channel strain as well as RF properties, including capacitance-conductance, improved split C-V, magnetoresistance, charge pumping, low frequency noise, and Raman spectroscopy.

This proceedings volume features 59 peer-reviewed papers from ICCCI2009 on interface characterization and control technology, powder and composite processing, joining, the control of airborne particulates, new metallic glasses, and interface phenomena at high temperature. ICCCI2009 was supported by the Global COE Program “Center of Excellence for Advanced Structural and Functional Materials Design” lead by Professor Tomoyuki Kakeshita at Osaka University, the Project on Joining Technology for New Metallic Glasses and Inorganic Materials, the Institute of Materials Research (IMR) of Tohoku University, the Materials and Structures Laboratory (MSL) of the Tokyo Institute of Technology, Kobe Gakuin University, Hosokawa Powder Technology Foundation, the Japan JSPS 124th Committee, and the Joining and Welding Research Institute (JWRI) of Osaka University. Over 160 scientists and engineers from academia and industry from 18 different countries attended ICCCI2009 to see and discuss 140 invited and contributed presentations and posters on the state-of-the-art of interface characterization and control for particulate materials, joining, and nanotechnology.

This title presents the general principles of instrumentation processes. It explains the theoretical analysis of physical phenomena used by standard sensors and transducers to transform a physical value into an electrical signal. The pre-processing of these signals through electronic circuits – amplification, signal filtering and analog-to-digital conversion – is then detailed, in order to provide useful basic information. Attention is then given to general complex systems. Topics covered include instrumentation and measurement chains, sensor modeling, digital signal processing and diagnostic methods and the concept of smart sensors, as well as microsystem design and applications. Numerous industrial examples punctuate the discussion, setting the subjects covered in the book in their practical context.