Mechanical Stress on the Nanoscale. Simulation, Material Systems and Characterization Techniques

Derived from the highly acclaimed series Materials Science and Technology, this book provides in-depth coverage of STM, AFM, and related non-contact nanoscale probes along with detailed applications, such as the manipulation of atoms and clusters on a nanometer scale. The methods are described in terms of the physics and the technology of the methods and many high-quality images demonstrate the power of these techniques in the investigation of surfaces and the processes which occur on them. Topics include: Semiconductor Surfaces and Interfaces * Insulators * Layered Compounds * Charge Density Wave Systems * Superconductors * Electrochemisty at Liquid-Solid Interfaces * Biological Systems * Metrological Applications * Nanoscale Surface Forces * Nanotribology * Manipulation on the Nanoscale Materials scientists, surface scientists, electrochemists, as well as scientists working in catalysis and microelectronics will find this book an invaluable source of information

This Third Edition updates a landmark text with the latest findings The Third Edition of the internationally lauded Semiconductor Material and Device Characterization brings the text fully up-to-date with the latest developments in the field and includes new pedagogical tools to assist readers. Not only does the Third Edition set forth all the latest measurement techniques, but it also examines new interpretations and new applications of existing techniques. Semiconductor Material and Device Characterization remains the sole text dedicated to characterization techniques for measuring semiconductor materials and devices. Coverage includes the full range of electrical and optical characterization methods, including the more specialized chemical and physical techniques. Readers familiar with the previous two editions will discover a thoroughly revised and updated Third Edition, including: Updated and revised figures and examples reflecting the most current data and information 260 new references offering access to the latest research and discussions in specialized topics New problems and review questions at the end of each chapter to test readers' understanding of the material In addition, readers will find fully updated and revised sections in each chapter. Plus, two new chapters have been added: Charge-Based and Probe Characterization introduces charge-based measurement and Kelvin probes. This chapter also examines probe-based measurements, including scanning capacitance, scanning Kelvin force, scanning spreading resistance, and ballistic electron emission microscopy. Reliability and Failure Analysis examines failure times and distribution functions, and discusses electromigration, hot carriers, gate oxide integrity, negative bias temperature instability, stress-induced leakage current, and electrostatic discharge. Written by an internationally recognized authority in the field, Semiconductor Material and Device Characterization remains essential reading for graduate students as well as for professionals working in the field of semiconductor devices and materials. An Instructor's Manual presenting detailed solutions to all the problems in the book is available from the Wiley editorial department.

System Simulation Techniques with MATLAB and Simulink comprehensively explains how to use MATLAB and Simulink to perform dynamic systems simulation tasks for engineering and non-engineering applications. This book begins with covering the fundamentals of MATLAB programming and applications, and the solutions to different mathematical problems in simulation. The fundamentals of Simulink modelling and simulation are then presented, followed by coverage of intermediate level modelling skills and more advanced techniques in Simulink modelling and applications. Finally the modelling and simulation of engineering and non-engineering systems are presented. The areas covered include electrical, electronic systems, mechanical systems, pharmacokinetic systems, video and image processing systems and discrete event systems. Hardware-in-the-loop simulation and real-time application are also discussed. Key features: Progressive building of simulation skills using Simulink, from basics through to advanced levels, with illustrations and examples Wide coverage of simulation topics of applications from engineering to non-engineering systems Dedicated chapter on hardware-in-the-loop simulation and real time control End of chapter exercises A companion website hosting a solution manual and powerpoint slides System Simulation Techniques with MATLAB and Simulink is a suitable textbook for senior undergraduate/postgraduate courses covering modelling and simulation, and is also an ideal reference for researchers and practitioners in industry.

Systems engineering is the design of a complex interconnection of many elements (a system) to maximize a specific measure of system performance. It consists of two parts: modeling, in which each element of the system and its performance criteria are described; and optimization in which adjustable elements are tailored to allow peak performance. Systems engineering is applied to vast numbers of problems in industry and the military. An example of systems engineering at work is the control of the timing of thousands of city traffic lights to maximize traffic flow. The complex and intricate field of electronics and computers is perfectly suited for systems engineering analysis and in turn, advances in communications and computer technology have made more advanced systems engineering problems solvable. Thus, the two areas fed off of one another. This book is a basic introduction to the use of models and methods in the engineering design of systems. It is aimed at students as well as practicing engineers. The concept of the «systems of systems» is discussed extensively, after a critical comparison of the different definitions and a range of various practical illustrations. It also provides key answers as to what a system of systems is and how its complexity can be mastered.

The only book to present the synergy between modeling and simulation, systems engineering, and agent technologies expands the notion of agent-based simulation to also deal with agent simulation and agent-supported simulation. Accessible to both practitioners and managers, it systematically addresses designing and building agent systems from a systems engineering perspective.

A fundamental resource for understanding and developing effective self-assembly and nanotechnology systems Systematically integrating self-assembly, nanoassembly, and nanofabrication into one easy-to-use source, Self-Assembly and Nanotechnology Systems effectively helps students, professors, and researchers comprehend and develop applicable techniques for use in the field. Through case studies, countless examples, clear questions, and general applications, this book provides experiment-oriented techniques for designing, applying, and characterizing self-assembly and nanotechnology systems. Self-Assembly and Nanotechnology Systems includes: Techniques for identifying assembly building units Practical assembly methods to focus on when developing nanomaterials, nanostructures, nanoproperties, nanofabricated systems, and nanomechanics Algorithmic diagrams in each chapter for a general overview Schematics designed to link assembly principles with actual systems Hands-on lab activities This informative reference also analyzes the diverse origins and structures of assembly building units, segmental analysis, and selection of assembly principles, methods, characterization techniques, and predictive models. Complementing the author's previous conceptually based book on this topic, Self-Assembly and Nanotechnology Systems is a practical guide that grants practitioners not only the skills to properly analyze assembly building units but also how to work with applications to exercise and develop their knowledge of this rapidly advancing scientific field.

With its focus on the characterization of nanocomposites using such techniques as x-ray diffraction and spectrometry, light and electron microscopy, thermogravimetric analysis, as well as nuclear magnetic resonance and mass spectroscopy, this book helps to correctly interpret the recorded data. Each chapter introduces a particular characterization method, along with its foundations, and makes the user aware of its benefits, but also of its drawbacks. As a result, the reader will be able to reliably predict the microstructure of the synthesized polymer nanocomposite and its thermal and mechanical properties, and so assess its suitability for a particular application. Belongs on the shelf of every product engineer.

The numerical simulation of manufacturing processes and of their mechanical consequences is of growing interest in industry. However, such simulations need the modeling of couplings between several physical phenomena such as heat transfer, material transformations and solid or fluid mechanics, as well as to be adapted to numerical methodologies. This book gathers a state of the art on how to simulate industrial processes, what data are needed and what numerical simulation can bring. Assembling processes such as welding and friction stir welding, material removal processes, elaboration processes of composite structures, sintering processes, surface-finishing techniques, and thermo-chemical treatments are investigated. This book is the work of a group of researchers who have been working together in this field for more than 12 years. It should prove useful for both those working in industry and those studying the numerical methods applied to multiphysics problems encountered in manufacturing processes.

The numerical simulation of manufacturing processes and of their mechanical consequences is of growing interest in industry. However, such simulations need the modeling of couplings between several physical phenomena such as heat transfer, material transformations and solid or fluid mechanics, as well as to be adapted to numerical methodologies. This book gathers a state of the art on how to simulate industrial processes, what data are needed and what numerical simulation can bring. Assembling processes such as welding and friction stir welding, material removal processes, elaboration processes of composite structures, sintering processes, surface-finishing techniques, and thermo-chemical treatments are investigated. This book is the work of a group of researchers who have been working together in this field for more than 12 years. It should prove useful for both those working in industry and those studying the numerical methods applied to multiphysics problems encountered in manufacturing processes.

Presenting unified coverage of the design and modeling of smart micro- and macrosystems, this book addresses fabrication issues and outlines the challenges faced by engineers working with smart sensors in a variety of applications. Part I deals with the fundamental concepts of a typical smart system and its constituent components. Preliminary fabrication and characterization concepts are introduced before design principles are discussed in detail. Part III presents a comprehensive account of the modeling of smart systems, smart sensors and actuators. Part IV builds upon the fundamental concepts to analyze fabrication techniques for silicon-based MEMS in more detail. Practicing engineers will benefit from the detailed assessment of applications in communications technology, aerospace, biomedical and mechanical engineering. The book provides an essential reference or textbook for graduates following a course in smart sensors, actuators and systems.