Electrical Modeling and Design for 3D System Integration. 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC

Most existing robust design books address design for static systems, or achieve robust design from experimental data via the Taguchi method. Little work considers model information for robust design particularly for the dynamic system. This book covers robust design for both static and dynamic systems using the nominal model information or the hybrid model/data information, and also integrates design with control under a large operating region. This design can handle strong nonlinearity and more uncertainties from model and parameters.

This book provides a balanced account of analog, digital and mixed-mode signal processing with applications in telecommunications. Part I Perspective gives an overview of the areas of Systems on a Chip (Soc) and mobile communication which are used to demonstrate the complementary relationship between analog and digital systems. Part II Analog (continuous-time) and Digital Signal Processing contains both fundamental and advanced analysis, and design techniques, of analog and digital systems. This includes analog and digital filter design; fast Fourier transform (FFT) algorithms; stochastic signals; linear estimation and adaptive filters. Part III Analog MOS Integrated Circuits for Signal Processing covers basic MOS transistor operation and fabrication through to the design of complex integrated circuits such as high performance Op Amps, Operational Transconductance Amplifiers (OTA's) and Gm-C circuits. Part IV Switched-capacitor and Mixed-mode Signal Processing outlines the design of switched-capacitor filters, and concludes with sigma-delta data converters as an extensive application of analog and digital signal processing Contains the fundamentals and advanced techniques of continuous-time and discrete-time signal processing. Presents in detail the design of analog MOS integrated circuits for signal processing, with application to the design of switched-capacitor filters. Uses the comprehensive design of integrated sigma-delta data converters to illustrate and unify the techniques of signal processing. Includes solved examples, end of chapter problems and MATLAB® throughout the book, to help readers understand the mathematical complexities of signal processing. The treatment of the topic is at the senior undergraduate to graduate and professional levels, with sufficient introductory material for the book to be used as a self-contained reference.

In Optoelectronic Integrated Circuit Design and Device Modeling, Professor Jianjun Gao introduces the fundamentals and modeling techniques of optoelectronic devices used in high-speed optical transmission systems. Gao covers electronic circuit elements such as FET, HBT, MOSFET, as well as design techniques for advanced optical transmitter and receiver front-end circuits. The book includes an overview of optical communication systems and computer-aided optoelectronic IC design before going over the basic concept of laser diodes. This is followed by modeling and parameter extraction techniques of lasers and photodiodes. Gao covers high-speed electronic semiconductor devices, optical transmitter design, and optical receiver design in the final three chapters. Addresses a gap within the rapidly growing area of transmitter and receiver modeling in OEICs Explains diode physics before device modeling, helping readers understand their equivalent circuit models Provides comprehensive explanations for E/O and O/E conversions done with laser and photodiodes Covers an extensive range of devices for high-speed applications Accessible for students new to microwaves Presentation slides available for instructor use This book is primarily aimed at practicing engineers, researchers, and post-graduates in the areas of RF, microwaves, IC design, photonics and lasers, and solid state devices. The book is also a strong supplement for senior undergraduates taking courses in RF and microwaves. Lecture materials for instructors available at www.wiley.com/go/gao

The only book on integrated circuits for optical communications that fully covers High-Speed IOs, PLLs, CDRs, and transceiver design including optical communication The increasing demand for high-speed transport of data has revitalized optical communications, leading to extensive work on high-speed device and circuit design. With the proliferation of the Internet and the rise in the speed of microprocessors and memories, the transport of data continues to be the bottleneck, motivating work on faster communication channels. Design of Integrated Circuits for Optical Communications, Second Edition deals with the design of high-speed integrated circuits for optical communication transceivers. Building upon a detailed understanding of optical devices, the book describes the analysis and design of critical building blocks, such as transimpedance and limiting amplifiers, laser drivers, phase-locked loops, oscillators, clock and data recovery circuits, and multiplexers. The Second Edition of this bestselling textbook has been fully updated with: A tutorial treatment of broadband circuits for both students and engineers New and unique information dealing with clock and data recovery circuits and multiplexers A chapter dedicated to burst-mode optical communications A detailed study of new circuit developments for optical transceivers An examination of recent implementations in CMOS technology This text is ideal for senior graduate students and engineers involved in high-speed circuit design for optical communications, as well as the more general field of wireline communications.

Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming «test and try out» method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter. Models and simulates numerous processes in manufacturing, reliability and testing for the first time Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products Covers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects Appendix and color images available for download from the book's companion website Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource. Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging

Presents comprehensive coverage of process intensification and integration for sustainable design, along with fundamental techniques and experiences from the industry  Drawing from fundamental techniques and recent industrial experiences, this book discusses the many developments in process intensification and integration and focuses on increasing sustainability via several overarching topics such as Sustainable Manufacturing, Energy Saving Technologies, and Resource Conservation and Pollution Prevention Techniques.  Process Intensification and Integration for Sustainable Design   starts discussions on: shale gas as an option for the production of chemicals and challenges for process intensification; the design and techno-economic analysis of separation units to handle feedstock variability in shale gas treatment; RO-PRO desalination; and techno-economic and environmental assessment of ultrathin polysulfone membranes for oxygen-enriched combustion. Next, it looks at process intensification of membrane-based systems for water, energy, and environment applications; the design of internally heat-integrated distillation column (HIDiC); and graphical analysis and integration of heat exchanger networks with heat pumps. Decomposition and implementation of large-scale interplant heat integration is covered, as is the synthesis of combined heat and mass exchange networks (CHAMENs) with renewables. The book also covers optimization strategies for integrating and intensifying housing complexes; a sustainable biomass conversion process assessment; and more.  Covers the many advances and changes in process intensification and integration Provides side-by-side discussions of fundamental techniques and recent industrial experiences to guide practitioners in their own processes Presents comprehensive coverage of topics relevant, among others, to the process industry, biorefineries, and plant energy management Offers insightful analysis and integration of reactor and heat exchanger network Looks at optimization of integrated water and multi-regenerator membrane systems involving multi-contaminants  Process Intensification and Integration for Sustainable Design  is an ideal book for process engineers, chemical engineers, engineering scientists, engineering consultants, and chemists.

Diode Lasers and Photonic Integrated Circuits, Second Edition provides a comprehensive treatment of optical communication technology, its principles and theory, treating students as well as experienced engineers to an in-depth exploration of this field. Diode lasers are still of significant importance in the areas of optical communication, storage, and sensing. Using the the same well received theoretical foundations of the first edition, the Second Edition now introduces timely updates in the technology and in focus of the book. After 15 years of development in the field, this book will offer brand new and updated material on GaN-based and quantum-dot lasers, photonic IC technology, detectors, modulators and SOAs, DVDs and storage, eye diagrams and BER concepts, and DFB lasers. Appendices will also be expanded to include quantum-dot issues and more on the relation between spontaneous emission and gain.

3D Face Modeling, Analysis and Recognition presents methodologies for analyzing shapes of facial surfaces, develops computational tools for analyzing 3D face data, and illustrates them using state-of-the-art applications. The methodologies chosen are based on efficient representations, metrics, comparisons, and classifications of features that are especially relevant in the context of 3D measurements of human faces. These frameworks have a long-term utility in face analysis, taking into account the anticipated improvements in data collection, data storage, processing speeds, and application scenarios expected as the discipline develops further. The book covers face acquisition through 3D scanners and 3D face pre-processing, before examining the three main approaches for 3D facial surface analysis and recognition: facial curves; facial surface features; and 3D morphable models. Whilst the focus of these chapters is fundamentals and methodologies, the algorithms provided are tested on facial biometric data, thereby continually showing how the methods can be applied. Key features: • Explores the underlying mathematics and will apply these mathematical techniques to 3D face analysis and recognition • Provides coverage of a wide range of applications including biometrics, forensic applications, facial expression analysis, and model fitting to 2D images • Contains numerous exercises and algorithms throughout the book

Achieve higher levels of performance, integration, compactness, and cost-effectiveness in the design and modeling of radio-frequency (RF) power amplifiers RF power amplifiers are important components of any wireless transmitter, but are often the limiting factors in achieving better performance and lower cost in a wireless communication system—presenting the RF IC design community with many challenges. The next-generation technological advances presented in this book are the result of cutting-edge research in the area of large-signal device modeling and RF power amplifier design at the Georgia Institute of Technology, and have the potential to significantly address issues of performance and cost-effectiveness in this area. Richly complemented with hundreds of figures and equations, Modeling and Design Techniques for RF Power Amplifiers introduces and explores the most important topics related to RF power amplifier design under one concise cover. With a focus on efficiency enhancement techniques and the latest advances in the field, coverage includes: Device modeling for CAD Empirical modeling of bipolar devices Scalable modeling of RF MOSFETs Power amplifier IC design Power amplifier design in silicon Efficiency enhancement of RF power amplifiers The description of state-of-the-art techniques makes this book a valuable and handy reference for practicing engineers and researchers, while the breadth of coverage makes it an ideal text for graduate- and advanced undergraduate-level courses in the area of RF power amplifier design and modeling.