Lead-free Electronics

Based on the results of a more than two-year study, Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing is the first practical, primary reference to cover Pb-free solder assembly as well as the analysis and reasoning behind the selection of Sn-Ag-Cu as the recommended Pb-free replacement for Sn-Pb. Reflecting the results of a two-year study, Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing provides full coverage of the issues surrounding the implementation of Pb-free solder into electronic board assembly. This book is extremely timely???most electronic manufacturers are going to change over to Pb free soldering by 2006 to meet new European laws. All manufacturers around the globe are going to be affected by this change. The text provides specific results from the thirty company NEMI project activities. It contains integrated and fully documented book chapters with references to existing published work in the area. These serve as tremendous resources for engineers and companies faced with making the switch to Pb-free solder assembly.

Provides in-depth knowledge on lead-free piezoelectrics – for state-of-the-art, environmentally friendly electrical and electronic devices! Lead zirconate titanate ceramics have been market-dominating due to their excellent properties and flexibility in terms of compositional modifications. Driven by the Restriction of Hazardous Substances Directive, there is a growing concern on the toxicity of lead. Therefore, numerous research efforts were devoted to lead-free piezoelectrics from the beginning of this century. Great progress has been made in the development of high-performance lead-free piezoelectric ceramics which are already used, e.g., for power electronics applications. Lead-Free Piezoelectric Materials provides an in-depth overview of principles, material systems, and applications of lead-free piezoelectric materials. It starts with the fundamentals of piezoelectricity and lead-free piezoelectrics. Then it discusses four representative lead-free piezoelectric material systems from background introduction to crystal structures and properties. Finally, it presents several applications of lead-free piezoelectrics including piezoelectric actuators, and transducers. The challenges for promoting applications will also be discussed. Highly attractive: Lead-free piezoelectrics address the growing concerns on exclusion of hazardous substances used in electrical and electronic devices in order to protect human health and the environment Thorough overview: Covers fundamentals, different classes of materials, processing and applications Unique: discusses fundamentals and recent advancements in the field of lead-free piezoelectrics Lead-Free Piezoelectric Materials is of high interest for material scientists, electrical and chemical engineers, solid state chemists and physicists in academia and industry.

Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risks This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. The text begins with a review of the characteristic properties of local microstructures around whisker and hillock grains to identify why these particular grains and locations become predisposed to forming whiskers and hillocks. The book discusses the basic properties of tin-based alloy finishes and the effects of various alloying elements on whisker formation, with a focus on potential mechanisms for whisker suppression or enhancement for each element. Tin whisker risk mitigation strategies for each tier of the supply chain for high reliability electronic systems are also described. Discusses whisker formation factors including surface grain geometry, crystallographic orientation-dependent surface grain boundary structure, and the localization of elastic strain/strain energy density distribution Examines how whiskers and hillocks evolve in time through real-time studies of whisker growth with the scanning electron microscope/focused ion beaming milling (SEM/FIB) Covers characterization methods of tin and tin-based alloy finishes such as transmission electron microscopy (TEM), scanning electron microscopy (SEM), and electron backscatter diffraction (EBSD) Reviews theories of mechanically-induced tin whiskers with case studies using pure tin and other lead-free finishes shown to evaluate the pressure-induced tin whiskers Mitigating Tin Whisker Risks: Theory and Practice is intended for the broader electronic packaging and manufacturing community including: manufacturing engineers, packaging development engineers, as well as engineers and researchers in high reliability industries.

On a daily basis, our requirements for technology become more innovative and creative and the field of electronics is helping to lead the way to more advanced appliances. This book gathers and evaluates the materials, designs, models, and technologies that enable the fabrication of fully elastic electronic devices that can tolerate high strain. Written by some of the most outstanding scientists in the field, it lays down the undisputed knowledge on how to make electronics withstand stretching. This monograph provides a review of the specific applications that directly benefit from highly compliant electronics, including transistors, photonic devices, and sensors. In addition to stretchable devices, the topic of ultraflexible electronics is treated, highlighting its upcoming significance for the industrial-scale production of electronic goods for the consumer. Divided into four parts covering: * Theory * Materials and Processes * Circuit Boards * Devices and Applications An unprecedented overview of this thriving area of research that nobody in the field – or intending to enter it – can afford to miss.

The fundamentals and implementation of digital electronics are essential to understanding the design and working of consumer/industrial electronics, communications, embedded systems, computers, security and military equipment. Devices used in applications such as these are constantly decreasing in size and employing more complex technology. It is therefore essential for engineers and students to understand the fundamentals, implementation and application principles of digital electronics, devices and integrated circuits. This is so that they can use the most appropriate and effective technique to suit their technical need. This book provides practical and comprehensive coverage of digital electronics, bringing together information on fundamental theory, operational aspects and potential applications. With worked problems, examples, and review questions for each chapter, Digital Electronics includes: information on number systems, binary codes, digital arithmetic, logic gates and families, and Boolean algebra; an in-depth look at multiplexers, de-multiplexers, devices for arithmetic operations, flip-flops and related devices, counters and registers, and data conversion circuits; up-to-date coverage of recent application fields, such as programmable logic devices, microprocessors, microcontrollers, digital troubleshooting and digital instrumentation. A comprehensive, must-read book on digital electronics for senior undergraduate and graduate students of electrical, electronics and computer engineering, and a valuable reference book for professionals and researchers.

This book provides an overview of the newly emerged and highly interdisciplinary field of printed electronics • Provides an overview of the latest developments and research results in the field of printed electronics • Topics addressed include: organic printable electronic materials, inorganic printable electronic materials, printing processes and equipments for electronic manufacturing, printable transistors, printable photovoltaic devices, printable lighting and display, encapsulation and packaging of printed electronic devices, and applications of printed electronics • Discusses the principles of the above topics, with support of examples and graphic illustrations • Serves both as an advanced introductory to the topic and as an aid for professional development into the new field • Includes end of chapter references and links to further reading

Edited and written by the leading researchers and engineers from such companies as Philips, 3M, Xerox, Infineon, PlasticLogic, Eastman Kodak, Dupont, AIXTRON, and Hueck Folien, this book presents unrivalled and undiluted expertise from those who know best how to assess the risks, opportunities and where this technology is really heading. As such, this practical approach complements the more scientific and fundamentals-oriented literature on the market by providing readers with a first-hand insight into industrial activities to commercialize organic electronics. Following an introduction to the topic, including the history, motivation, benefits and potentials, it reviews recent advances and covers all three important facets of organic electronics: the chemical compounds and materials, manufacturing techniques, and the resulting devices together with their current applications.

Provides in-depth knowledge on novel materials that make electronics work under high-temperature and high-pressure conditions This book reviews the state of the art in research and development of lead-free interconnect materials for electronic packaging technology. It identifies the technical barriers to the development and manufacture of high-temperature interconnect materials to investigate into the complexities introduced by harsh conditions. It teaches the techniques adopted and the possible alternatives of interconnect materials to cope with the impacts of extreme temperatures for implementing at industrial scale. The book also examines the application of nanomaterials, current trends within the topic area, and the potential environmental impacts of material usage. Written by world-renowned experts from academia and industry, Harsh Environment Electronics: Interconnect Materials and Performance Assessment covers interconnect materials based on silver, gold, and zinc alloys as well as advanced approaches utilizing polymers and nanomaterials in the first section. The second part is devoted to the performance assessment of the different interconnect materials and their respective environmental impact. -Takes a scientific approach to analyzing and addressing the issues related to interconnect materials involved in high temperature electronics -Reviews all relevant materials used in interconnect technology as well as alternative approaches otherwise neglected in other literature -Highlights emergent research and theoretical concepts in the implementation of different materials in soldering and die-attach applications -Covers wide-bandgap semiconductor device technologies for high temperature and harsh environment applications, transient liquid phase bonding, glass frit based die attach solution for harsh environment, and more -A pivotal reference for professionals, engineers, students, and researchers Harsh Environment Electronics: Interconnect Materials and Performance Assessment is aimed at materials scientists, electrical engineers, and semiconductor physicists, and treats this specialized topic with breadth and depth.

The challenge for producing “invisible” electronic circuitry and opto-electronic devices is that the transistor materials must be transparent to visible light yet have good carrier mobilities. This requires a special class of materials having “contra-indicated properties” because from the band structure point of view, the combination of transparency and conductivity is contradictory. Structured to strike a balance between introductory and advanced topics, this monograph juxtaposes fundamental science and technology / application issues, and essential materials characteristics versus device architecture and practical applications. The first section is devoted to fundamental materials compositions and their properties, including transparent conducting oxides, transparent oxide semiconductors, p-type wide-band-gap semiconductors, and single-wall carbon nanotubes. The second section deals with transparent electronic devices including thin-film transistors, photovoltaic cells, integrated electronic circuits, displays, sensors, solar cells, and electro-optic devices. Describing scientific fundamentals and recent breakthroughs such as the first “invisible” transistor, Transparent Electronics: From Synthesis to Applications brings together world renowned experts from both academia, national laboratories, and industry.