Adhesion in Microelectronics

To the layman, adhesion is a simple matter of how well two different materials stick together, and adhesion measurements provide some indication of the force required to separate them. However, a more detailed look at adhesion shows that it is a very important feature of food throughout its manufacturing, packaging and storage. Chapters are fully devoted to the fascinating topic of adhesion in foods. Key features of the book include, but are not limited to: definition and nomenclature of adhesion; adhesion mechanisms and measurements; stickiness in various foods and its relation to technological processes; perception of stickiness; hydrocolloids as adhesive agents for foods; adhesion phenomena in coated, battered, breaded and fried foods; electrostatic adhesion in foods; multilayered adhered food products, and adhesion of substances to packaging and cookware. Adhesion in Foods: Fundamental Principles and Applications is dedicated not only to the academic community but also to the broader population of industrialists and experimentalists who will find it to be not only a source of knowledge, but also a launching pad for novel ideas and inventions. In particular, this book is expected to be of interest to personnel involved in food formulation, food scientists, food technologists, industrial chemists and engineers, and those working in product development.

Microelectronics is a complex world where many sciences need to collaborate to create nano-objects: we need expertise in electronics, microelectronics, physics, optics and mechanics also crossing into chemistry, electrochemistry, as well as biology, biochemistry and medicine. Chemistry is involved in many fields from materials, chemicals, gases, liquids or salts, the basics of reactions and equilibrium, to the optimized cleaning of surfaces and selective etching of specific layers. In addition, over recent decades, the size of the transistors has been drastically reduced while the functionality of circuits has increased. This book consists of five chapters covering the chemicals and sequences used in processing, from cleaning to etching, the role and impact of their purity, along with the materials used in “Front End Of the Line” which corresponds to the heart and performance of individual transistors, then moving on to the “Back End Of the Line” which is related to the interconnection of all the transistors. Finally, the need for specific functionalization also requires key knowledge on surface treatments and chemical management to allow new applications. Contents 1. Chemistry in the “Front End of the Line” (FEOL): Deposits, Gate Stacks, Epitaxy and Contacts, Fran?ois Martin, Jean-Michel Hartmann, V?ronique Carron and Yannick Le Tiec. 2. Chemistry in Interconnects, Vincent Jousseaume, Paul-Henri Haumesser, Carole Pernel, Jeffery Butterbaugh, Sylvain Ma?trejean and Didier Louis. 3. The Chemistry of Wet Surface Preparation: Cleaning, Etching and Drying, Yannick Le Tiec and Martin Knotter. 4. The Use and Management of Chemical Fluids in Microelectronics, Christiane Gottschalk, Kevin Mclaughlin, Julie Cren, Catherine Peyne and Patrick Valenti. 5. Surface Functionalization for Micro- and Nanosystems: Application to Biosensors, Antoine Hoang, Gilles Marchand, Guillaume Nonglaton, Isabelle Texier-Nogues and Francoise Vinet. About the Authors Yannick Le Tiec is a technical expert at CEA-Leti, Minatec since 2002. He is a CEA-Leti assignee at IBM, Albany (NY) to develop the advanced 14 nm CMOS node and the FDSOI technology. He held different technical positions from the advanced 300 mm SOI CMOS pilot line to different assignments within SOITEC for advanced wafer development and later within INES to optimize solar cell ramp-up and yield. He has been part of the ITRS Front End technical working group at ITRS since 2008.

Leaders in the field predict the future of the microelectronics industry This seventh volume of Future Trends in Microelectronics summarizes and synthesizes the latest high-level scientific discussions to emerge from the Future Trends in Microelectronics international workshop, which has occurred every three years since 1995. It covers the full scope of cutting-edge topics in microelectronics, from new physical principles (quantum computing, correlated electrons), to new materials (piezoelectric nanostructures, terahertz plasmas), to emerging device technologies (embedded magnetic memories, spin lasers, and biocompatible microelectronics). An ideal book for microelectronics professionals and students alike, this volume of Future Trends in Microelectronics: Identifies the direction in which microelectronics is headed, enabling readers to move forward with research in an informed, efficient, and profitable manner Includes twenty-nine contributor chapters by international authorities from leading universities, major semiconductor companies, and government laboratories Provides a unified, cohesive exploration of various trends in microelectronics, looking to future opportunities, rather than past successes

Presents the developments in microelectronic-related fields, with comprehensive insight from a number of leading industry professionals The book presents the future developments and innovations in the developing field of microelectronics. The book’s chapters contain contributions from various authors, all of whom are leading industry professionals affiliated either with top universities, major semiconductor companies, or government laboratories, discussing the evolution of their profession. A wide range of microelectronic-related fields are examined, including solid-state electronics, material science, optoelectronics, bioelectronics, and renewable energies. The topics covered range from fundamental physical principles, materials and device technologies, and major new market opportunities. Describes the expansion of the field into hot topics such as energy (photovoltaics) and medicine (bio-nanotechnology) Provides contributions from leading industry professionals in semiconductor micro- and nano-electronics Discusses the importance of micro- and nano-electronics in today’s rapidly changing and expanding information society Future Trends in Microelectronics: Journey into the Unknown is written for industry professionals and graduate students in engineering, physics, and nanotechnology.

In this book leading profesionals in the semiconductor microelectronics field discuss the future evolution of their profession. The following are some of the questions discussed: Does CMOS technology have a real problem? Do transistors have to be smaller or just better and made of better materials? What is to come after semiconductors? Superconductors or molecular conductors? Is bottom-up self-assembling the answer to the limitation of top-down lithography? Is it time for Optics to become a force in computer evolution? Quantum Computing, Spintronics? Where is the printable plastic electronics proposed 10 years ago? Are carbon nanotube transistors the CMOS of the future?

This book is based on the 13 review articles written by subject experts and published in 2014 in the Journal Reviews of Adhesion and Adhesives. The rationale for publication of this book is that currently the RAA has limited circulation, so this book provides broad exposure and dissemination of the concise, critical, illuminating, and thought-provoking review articles. The subjects of the reviews fall into 4 general areas: 1. Polymer surface modification 2. Biomedical, pharmaceutical and dental fields 3. Adhesives and adhesive joints 4. General Adhesion Aspects The topics covered include: Adhesion of condensed bodies at microscale; imparting adhesion property to silicone material; functionally graded adhesively bonded joints; synthetic adhesives for wood panels; adhesion theories in wood adhesive bonding; adhesion and surface issues in biocomposites and bionanocomposites; adhesion phenomena in pharmaceutical products and applications of AFM; cyanoacrylate adhesives in surgical applications; ways to generate monosort functionalized polyolefin surfaces; nano-enhanced adhesives; bonding dissimilar materials in dentistry; flame treatment of polymeric materials—relevance to adhesion; and mucoadhesive polymers for enhancing retention of ocular drug delivery.

Activity in the arena of surface chemistry and adhesion aspects in cosmetics is substantial, but the information is scattered in many diverse publications media and no book exists which discusses surface chemistry and adhesion in cosmetics in unified manner. 

This book containing 15 chapters written by eminent researchers from academia and industry is divided into three parts: Part 1: General Topics; Part 2:Surface Chemistry Aspects; and Part 3: Wetting and Adhesion Aspects. The topics covered include: Lip biophysical properties and characterization; use of advanced silicone materials in long-lasting cosmetics; non-aqueous dispersions of acrylate copolymers in lipsticks; cosmetic oils in Lipstick structure; chemical structure of the hair surface, surface forces and interactions; AFM for hair surface characterization; application of AFM in characterizing hair, skin and cosmetic deposition; SIMS as a surface analysis method for hair, skin and cosmetics; surface tensiometry approach to characterize cosmetic products; spreading of hairsprays on hair; color transfer from long-wear face foundation products; interaction of polyelectrolytes and surfactants on hair surfaces; cosmetic adhesion to facial skin; and adhesion aspects in semi-permanent mascara; lipstick adhesion measurement.

The phenomenon of adhesion is of cardinal importance in the pharmaceutical, biomedical and dental fields. A few eclectic examples will suffice to underscore the importance/relevance of adhesion in these three areas. For example, the adhesion between powdered solids is of crucial importance in tablet manufacture. The interaction between biodevices (e.g., stents, bio-implants) and body environment dictates the performance of such devices, and there is burgeoning research activity in modifying the surfaces of such implements to render them compatible with bodily components. In the field of dentistry, the modern trend is to shift from retaining of restorative materials by mechanical interlocking to adhesive bonding. This unique book addresses all these three areas in an easily accessible single source. The book contains 15 chapters written by leading experts and is divided into four parts: General Topics; Adhesion in Pharmaceutical Field; Adhesion in Biomedical Field; and Adhesion in Dental Field. The topics covered include: – Theories or mechanisms of adhesion. – Wettability of powders. – Role of surface free energy in tablet strength and powder flow behavior. – Mucoadhesive polymers for drug delivery systems. – Transdermal patches. – Skin adhesion in long-wear cosmetics. – Factors affecting microbial adhesion. – Biofouling and ways to mitigate it. – Adhesion of coatings on surgical tools and bio-implants. – Adhesion in fabrication of microarrays in clinical diagnostics. – Antibacterial polymers for dental adhesives and composites. – Evolution of dental adhesives. – Testing of dental adhesives joints.

With the ever-increasing amount of research being published it is a Herculean task to be fully conversant with the latest research developments in any field, and the arena of adhesion and adhesives is no exception. Thus, topical review articles provide an alternate and very efficient way to stay abreast of the state-of-the-art in may subjects representing the field of adhesion science and adheisves. Based on the success and the warm reception accorded to the premier volume in this series “Progress in Adhesion and Adhesives” (containing the review articles published in Volume 2 (2014) of the journal Reviews of Adhesion and Adhesives (RAA)), volume 2 comprises 14 review articles published in Volume 4 (2016) of RAA. The subjects of these 14 reviews fall into the following general areas: 1. Surface modification of polymers for a variety of purposes. 2. Adhesion aspects in reinforced composites 3. Thin films/coatings and their adhesion measurement 4. Bioadhesion and bio-implants 5. Adhesives and adhesive joints 6. General adhesion aspects The topics covered include: surface modification of natural fibers for reinforced polymer composites; adhesion of submicrometer thin metals films; surface treatments to modulate bioadhesion; hot-melt adhesives from renewable resources; particulate-polymer composites; functionally graded adhesively bonded joints; fabrication of nano-biodevices; effects of particulates on contact angles , thermal stresses in adhesively bonded joints and ways to mitigate these; laser-assisted electroless metallization of polymer materials; adhesion measurement of coatings on biodevices/implants; cyanoacrylate adhesives; and adhesion of green flame retardant coatings onto polyolefins.